Stps of IC(Integrated Circuit) Fabrication

Crystal Growth:- It is a process of growing Silicon (or any other Semiconductor) of optimum purity level with a particular orientation.


Oxidation
Oxidation is a process of growing a layer of oxide on the bare Silicon substrate, the layer of oxide may be thin or thick for growing oxide layer we make silicone react with Dry O2 or Water vapors.

Photolithography
Photolithography is a process steps in IC fabrication that introduce concept of selective doping in the Substrate. Photolithography  is a process in which a suitable photoresist  is coated over the substrate. After choosing selectively mask it is exposed to the UV light of suitable frequency.

What happens in Photolithography
When we coat the surface of substrate with a thin layer of photo resist, and expose It to the Mask of suitable design, the region where UV light fall on the photoresist, it gets polymerized and becomes hard and where there is  blockage of UV light by mask it remains soft and can easily be cleaned by etching. After etching we got to have a predefined region of substrate where we can do doping. This technique is called window opening.

Diffusion | Ion Implantation | Chemical vapor Deposition(CVD) | Molecular Bean Epitaxy(MBE)
All above the process written above is technique of incorporating the dopants selectively in the substrate. Without these delicate and accurate process it is almost impossible to realize most of the semiconductor devices we are using today.

Epitaxy
Epitaxy means arrange upon, epitaxy involves growing of very thin layer on the substrate, like arranging  multiple rows & columns of atoms of particular dopant.

Contact Metallization
After creating a Semiconductor device, there is a need of creating a connection from the outer world for this purpose contact metallization is done it involves very thin deposition of metal layer on the surface of semiconductor. Contact Metallization is a process by which you are able to connect pins and terminals to a Semiconductor device.

Packaging:-

Packaging is the last process steps in the IC fabrication, it is like packaging of your Cake in a protective manner. Similarly delicate parts of Semiconductor is Packed in a packaging process. Packaging provides protection to environment condition to inner semiconductors.
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